Semiconductor package with stacked dice for a buck converter

Details Semiconductor package with stacked dice for a buck converter Semiconductor package with stacked dice for a buck converter

2008-01-28

2011-11-22

Sandvik, Benjamin (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23052, C438S109000

Reexamination Certificate

active

08063472

ABSTRACT:
Disclosed in this specification is a buck converter package with stacked dice and a process for forming a buck converter. The package includes a die attach pad with a low side die mounted on one surface and a high side die mounted on the opposing surface. The die attach pad is conductive, such that the drain of the low side die is connected to the source of the high side die through the pad. A controller die controls the gates of the high and low side dies. A plurality of leads extends outside of the package to permit electrical connections to the inside of the package. The high side drain is exposed to one of the surfaces of the package.

REFERENCES:
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patent: 2007/0249092 (2007-10-01), Joshi et al.
patent: 2010/0059875 (2010-03-01), Sato et al.

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