Semiconductor package with improved moisture vapor relief functi

Details Semiconductor package with improved moisture vapor relief functi Semiconductor package with improved moisture vapor relief functi

1998-10-09

2000-04-25

Fahmy, Wael

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257778, 257782, H01L 23495

Patent

active

060547553

ABSTRACT:
In order that popcorning and delamination resulting from moisture vapor in a semiconductor package may be prevented, a vent hole is formed in a die-bonding area of a plastic substrate so as to extend vertically through the substrate. An upper open end of the vent hole is covered with a solder resist film and a semiconductor chip is die-bonded on the solder resist film. In the die-bonding step, the solder resist film prevents an adhesive agent from flowing into the vent hole through the upper open end, so that gas permeability of the vent hole can be ensured. Furthermore, since the solder resist film has gas permeability, moisture vapor in the package is released outside through the vent hole and the solder resist film during a reflow heating.

REFERENCES:
patent: 5296738 (1994-03-01), Freyman et al.
patent: 5612576 (1997-03-01), Wilson et al.
patent: 5808873 (1998-09-01), Celaya et al.

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