Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2006-05-01
2009-08-04
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S724000, C438S107000
Reexamination Certificate
active
07569918
ABSTRACT:
A semiconductor system (300) has one or more packaged active subsystems (310, 330); each subsystem has a substrate with electrical contact pads and one or more semiconductor chips stacked on top of each other, assembled on the substrate. The system further has a packaged passive subsystem (320) including a substrate with electrical contacts and passive electrical components, such as resistors, capacitors, and indictors. The passive subsystem is stacked with the active subsystems and connected to them by solder bodies.
REFERENCES:
patent: 6297550 (2001-10-01), Chia et al.
patent: 6297551 (2001-10-01), Dudderar et al.
patent: 6489686 (2002-12-01), Farooq et al.
patent: 6734539 (2004-05-01), Degani et al.
patent: 7034387 (2006-04-01), Karnezos
patent: 7154175 (2006-12-01), Shrivastava et al.
patent: 7160757 (2007-01-01), Narkhede et al.
patent: 7242081 (2007-07-01), Lee
patent: 2003/0075811 (2003-04-01), Cohn et al.
patent: 2007/0158856 (2007-07-01), Narkhede et al.
patent: 2007/0235865 (2007-10-01), Bauer et al.
Castro Abram M.
Gerber Mark A.
Wachtler Kurt P.
Brady III Wade James
Clark S. V
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
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