Semiconductor package with molded plastic body

Details Semiconductor package with molded plastic body Semiconductor package with molded plastic body

1994-05-25

1999-10-19

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257717, 257706, 257796, 257736, 257 76, 257789, 257707, 257666, H01L 2302, H01L 2328, H01L 2336, H01L 2348

Patent

active

059694149

ABSTRACT:
There is provided a leadframe assembly for encapsulation in a polymer resin which prevents post-assembly fracture or swelling of the resin. The leadframe is coated with an adhesion enhancing layer that increases the shear stress required for delamination to in excess of about 3.4 MPa. In combination with this adhesion enhancing layer is a compliant die attach adhesive bonding an integrated circuit device to a central die attach paddle. This compliant die attach adhesive has a compliancy factor, E.multidot.a of less than 1.5 MPa/.degree.C. and a thickness of from about 0.01 mm to about 0.08 mm.

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