Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2004-10-28
2008-09-16
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S676000, C257SE23043, C257SE23047, C257SE23048
Reexamination Certificate
active
07425755
ABSTRACT:
A semiconductor package mainly includes a semiconductor chip and a plurality of leads at the periphery of the semiconductor chip. Each of the leads has a first portion, a second portion and opposing upper and lower surfaces, wherein the second portion of the leads are bent upwards. The semiconductor package has a plurality of bonding wires with one ends connected to the bonding pads of the semiconductor chip and the other ends connected to the first portions of the leads. The semiconductor package is provided with a package body formed over the semiconductor chip and the leads, wherein each of the leads is substantially embedded in the package body with the lower surface thereof exposed from the package body. The present invention further provides a method for manufacturing the semiconductor package.
REFERENCES:
patent: 5157480 (1992-10-01), McShane et al.
patent: 5309020 (1994-05-01), Murasawa et al.
patent: 5633530 (1997-05-01), Hsu
patent: 5801439 (1998-09-01), Fujisawa et al.
patent: 5835988 (1998-11-01), Ishii
patent: 5866939 (1999-02-01), Shin et al.
patent: 5986209 (1999-11-01), Tandy
patent: 6043430 (2000-03-01), Chun
patent: 6153928 (2000-11-01), Cho
patent: 6313598 (2001-11-01), Tamba et al.
patent: 6424031 (2002-07-01), Glenn
patent: 6433418 (2002-08-01), Fujisawa et al.
patent: 6605866 (2003-08-01), Crowley et al.
patent: 6661087 (2003-12-01), Wu
patent: 6730544 (2004-05-01), Yang
patent: 6781243 (2004-08-01), Li et al.
patent: 6876066 (2005-04-01), Fee et al.
patent: 6972479 (2005-12-01), Chen et al.
patent: 7049684 (2006-05-01), Minamio et al.
patent: 2002/0100963 (2002-08-01), Suzuki et al.
patent: 2002/0140068 (2002-10-01), Lee et al.
patent: 2002/0153599 (2002-10-01), Chang et al.
patent: 2002/0153601 (2002-10-01), Chang et al.
patent: 2003/0038347 (2003-02-01), Chiu et al.
patent: 2003/0042581 (2003-03-01), Fee et al.
patent: 2003/0067057 (2003-04-01), Wu
patent: 2003/0146501 (2003-08-01), Sasaki et al.
patent: 2003/0197290 (2003-10-01), Crowley et al.
patent: 2003/0222331 (2003-12-01), Lee et al.
patent: 2004/0016994 (2004-01-01), Huang
patent: 2004/0089921 (2004-05-01), Minamio et al.
patent: 2004/0145043 (2004-07-01), Hayashi et al.
patent: 2005/0093117 (2005-05-01), Masuda et al.
patent: 2005/0127494 (2005-06-01), Liu
patent: 2006/0017173 (2006-01-01), Wu et al.
patent: 2006/0175688 (2006-08-01), Jang
Advanced Semiconductor Engineering Inc.
Ho Hoang-Quan
Huynh Andy
LandOfFree
Semiconductor package, method for manufacturing the same and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package, method for manufacturing the same and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package, method for manufacturing the same and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3981196