Semiconductor package with passive device integration

Details Semiconductor package with passive device integration Semiconductor package with passive device integration

2011-06-14

2011-06-14

Sandvik, Benjamin P (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

C257S676000, C257SE23045, C257SE23037

Reexamination Certificate

active

07960816

ABSTRACT:
A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent.

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