Semiconductor packages having split die pad

Details Semiconductor packages having split die pad Semiconductor packages having split die pad

1995-08-07

2000-12-12

Potter, Roy

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257782, 257924, H01L 23495

Patent

active

061603074

ABSTRACT:
A semiconductor package including a semiconductor chip having a plurality of bonding pads, a die pad onto which the chip is mounted using a non-conductive adhesive, and a lead frame formed so as to have a plurality of inner and outer leads connected electrically to the bonding pads. The die pad is split into two or more segments, which are coupled together through a non-conductive connector.

REFERENCES:
patent: 4595945 (1986-06-01), Graver
patent: 4714952 (1987-12-01), Takekawa et al.
patent: 5021864 (1991-06-01), Kelly et al.
patent: 5065224 (1991-11-01), Fraser et al.
patent: 5457340 (1995-10-01), Templeton, Jr. et al.
Microelectronic Packaging Handbook, Noise Containment. pp. 143-153.

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