Semiconductor package with segmented lead frame

Details Semiconductor package with segmented lead frame Semiconductor package with segmented lead frame

1991-05-07

1994-01-25

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257693, H01L 2348, H01L 2350

Patent

active

052818497

ABSTRACT:
An improved semiconductor package (10) having a segmented lead frame (14) and (514) is disclosed. The preferred segmented lead frame (14) is divided into essentially identical segments (27) which have planes (22) attached to at least some of the associated individual leads (28). Segmentation of the lead frame (14) allows for the use of planes in inexpensive plastic and ceramic packages. Segmentation further allows the use of inexpensive aluminized stripes (42) to aluminize portions of individual leads (28) even in quad package configurations. An alternate equally preferred segmented lead frame (514) is provided for those applications wherein asymmetrical lead frames are required. Segmentation of the alternate segmented lead frame (514) permits the use of planes (522) and (552), while also limiting the cost of producing the alternate lead frame (514) especially when the etching method of production is required.

REFERENCES:
patent: 4663650 (1987-05-01), Gilder et al.
patent: 4663651 (1987-05-01), Gilder et al.
patent: 4857988 (1989-08-01), Fottler
patent: 4994936 (1991-02-01), Hernandez
VI SI Electronics Microstructure Science, vol. 9 Schroen and Pankratz, Chapter 5 pp. 185-204 Copyright 1985.
Glass Science and Technology, vol. 2 Singh Deo and Shukla, Chapter 6 pp. 169-203 Copyright 1984.

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