LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead-free and cyanide-free plating finish for semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead-on chip semiconductor device having peripheral bond pads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead-on-chip inner lead bonding lead frame method and apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead-on-chip integrated circuit apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead-on-chip semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead-on-chip semiconductor device and method for its fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Lead-on-chip semiconductor device and method for making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

Lead-on-chip type semiconductor device having thin plate and met

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Lead-on-clip lead frame and semiconductor package using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead-over-chip lead frames

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Lead-over-chip leadframes

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Leaded semiconductor packages and method of trimming and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leaded stacked packages having elevated die paddle

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Leaded stacked packages having integrated upper lead

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Leadframe allowing easy removal of tie bars in a resin-sealed se

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe alteration to direct compound flow into package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Leadframe alteration to direct compound flow into package