Leadframe

Details Leadframe Leadframe

1994-02-14

1996-09-24

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257674, H01L 23495

Patent

active

055593640

ABSTRACT:
A low-cost leadframe in which leads are stably and securely retained. The leadframe is provided with a lead retaining section for securely retaining internal leads together. Such a lead retaining section is molded from the same thermosetting resin as used for molding a resin encapsulated package and formed on the internal leads on the side of a die pad such that it extends, in the form of a strip, over the surfaces of the internal leads arranged in rows and such that it is adhered to the internal leads and embedded in the gaps between the internal leads.

REFERENCES:
patent: 4899207 (1990-02-01), Hallowell et al.
patent: 5031022 (1991-07-01), Yamamoto et al.
patent: 5072280 (1991-12-01), Matsukura
patent: 5177591 (1993-01-01), Emanuel
patent: 5294827 (1994-03-01), McShane

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