Lead-on-clip lead frame and semiconductor package using the same

Details Lead-on-clip lead frame and semiconductor package using the same Lead-on-clip lead frame and semiconductor package using the same

1997-05-27

1999-05-25

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257691, H01L 23495

Patent

active

059071869

ABSTRACT:
A lead-on-chip lead frame adapted to mount a chip divided into two independent circuit blocks thereon, the independent circuit blocks having pads arranged laterally and symmetrically with respect to a central portion of the chip, respectively. The lead-on-chip lead frame has a plurality of elongated common leads each adapted to wire-bond pads of each pad pair having the same function respectively arranged on the circuit blocks, each common lead extending laterally from the central portion of the chip in such a manner that it is lead out beyond a desired side edge of the chip. In this lead frame, the number of leads is reduced, thereby minimizing the size of the package.

REFERENCES:
patent: 5229329 (1993-07-01), Chai et al.
patent: 5250840 (1993-10-01), Oh et al.
patent: 5514905 (1996-05-01), Sakuta et al.
patent: 5521426 (1996-05-01), Russell
patent: 5585665 (1996-12-01), Anjoh et al.
patent: 5612569 (1997-03-01), Murakami et al.

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