Lead-frame strip and method of manufacturing semiconductor...

Details Lead-frame strip and method of manufacturing semiconductor... Lead-frame strip and method of manufacturing semiconductor...

2005-01-04

2005-01-04

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S670000, C257S676000

Reexamination Certificate

active

06838753

ABSTRACT:
Provided are a lead frame strip and a method of fabricating a semiconductor package using the same. The lead frame strip includes at least one lead frame panel in which a plurality of unit lead frames are arranged to be connected with one another in matrix forms, wherein each unit lead frame includes: a die pad to which a semiconductor chip is to be mounted; a tie bar, an end of which being connected to the die pad and processed to be downset; a plurality of leads positioned at the same level as another end of the tie bar and extended with a predetermined distance from the tie pad; a dam bar formed across the leads and united with the leads to support the leads, wherein a slot is formed along edges of the lead frame panel and functions as a buffer, and a connection bar is formed widthwise across the slot to support the lead frame panel.

REFERENCES:
patent: 5424576 (1995-06-01), Djennas et al.
patent: 6400004 (2002-06-01), Fan et al.

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