Leadframe

Details Leadframe Leadframe

1992-04-15

1993-06-29

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257670, 257674, 257676, H01L 2348, H01L 2328

Patent

active

052237389

ABSTRACT:
The present invention relates to a leadframe having slits around a semiconductor device forming area to absorb distortion or warpage of the leadframe because of the difference in the coefficients of thermal expansion of the leadframe and a sealing resin. The present invention is directed to limiting shifting of the outer leads caused by distortion or contraction of the leadframe and preventing cutting of the outer leads in a tie bar cutting process. To achieve these goals, positioning holes are provided on the inner portion of the leadframe in the vicinity of the tie bars at the three corners of the semiconductor device forming area but not at a corner where the resin injecting portion is located.

REFERENCES:
patent: 4477827 (1984-10-01), Walker et al.
patent: 4496965 (1985-01-01), Orcutt et al.
patent: 4868635 (1989-09-01), Frechette et al.
patent: 4870474 (1989-09-01), Karashima
patent: 4920074 (1990-04-01), Shimizu et al.
patent: 4977442 (1990-12-01), Suzuki et al.
patent: 5031022 (1991-07-01), Yamamoto et al.
patent: 5057901 (1991-10-01), Abel et al.

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