Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1992-09-30
1994-07-19
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257691, H01L 2348, H01L 2944, H01L 2552, H01L 2960
Patent
active
053312007
ABSTRACT:
A multi-level lead frame configuration (114) for an integrated circuit chip (116) comprises a main lead frame (115) having a plurality of lead frame bond fingers (122 and 124) that directly connect to a plurality of bond pads (126) on the integrated circuit chip (116). Associated with the main lead frame (115) is a bus bar lead frame (128 and 130) having a plurality of bus bar lead fingers (118 and 120) that directly connect to a second plurality of inner bond pads (126) on the integrated circuit chip (116). The bus bar bond fingers (118 and 120) associate with the main lead frame (115) and main lead frame bond fingers (122 and 124) to permit a lead-on-chip configuration of the main lead frame and the bus bar lead frame.
REFERENCES:
patent: 4754317 (1988-06-01), Comstock et al.
patent: 4801999 (1989-01-01), Hayward et al.
patent: 5068712 (1991-11-01), Murakami et al.
William C. Ward, "Volume Production of Unique Plastic Surface-Mount Modules for the IBM 80-NS 1-Mbit DRAM Chip by Area Wire Bond Techniques," 0569-5503/88/0000-0552, IEEE, pp. 552-557.
Karta Tjandra
Low Siu W.
Teo Boon C.
Clark S. V.
Donaldson Richard L.
Grossman Rene E.
Hille Rolf
Holland Robby T.
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