Lead-on-chip semiconductor device and method for making the same

Details Lead-on-chip semiconductor device and method for making the same Lead-on-chip semiconductor device and method for making the same

1992-11-27

1994-05-10

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257677, 257691, 257692, 257723, 257762, 257765, 257781, 257784, H01L 2302, H01L 23522, H01L 2349, H01L 2944

Patent

active

053110579

ABSTRACT:
A lead-on-chip (LOC) semiconductor device (10) has an integral decoupling capacitor in the form of a capacitor tape (20) attached to an active surface (14) of a semiconductor die (12). The capacitor tape includes two adhesive layers (22 and 24) to bond the die to the capacitor tape and to a plurality of leads (18). The tape also includes two conductive layers (26 and 28), made for instance of copper foil, which serve as the two electrodes of the capacitor. The electrodes are separated by a dielectric layer (30) which in one embodiment comprises barium-titanate (BaTiO.sub.3). The electrodes of the capacitor are electrically coupled to appropriate power and ground leads of the device by bonding wires (36 and 40) and to appropriate bonding pads (16) also by bonding wires (38 and 42). The bonding wires can be configured using any of three available wiring options. The present invention can also be implemented in a chip-on-lead (COL) device.

REFERENCES:
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4903113 (1990-02-01), Frankeny et al.
patent: 4965654 (1990-10-01), Karner et al.
patent: 4994936 (1991-02-01), Hernandez
patent: 5049979 (1991-09-01), Hashemi et al.
patent: 5067005 (1991-11-01), Michii et al.
patent: 5089876 (1992-02-01), Ishioka
patent: 5089878 (1992-02-01), Lee
patent: 5140496 (1992-08-01), Heinks et al.
patent: 5200364 (1993-04-01), Loh
patent: 5214845 (1993-06-01), King et al.
patent: 5252854 (1993-10-01), Arita et al.

Affiliated with

Also associated with

Rating

Lead-on-chip semiconductor device and method for making the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead-on-chip semiconductor device and method for making the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead-on-chip semiconductor device and method for making the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2414155