Leadframe allowing easy removal of tie bars in a resin-sealed se

Details Leadframe allowing easy removal of tie bars in a resin-sealed se Leadframe allowing easy removal of tie bars in a resin-sealed se

1997-07-14

1998-10-13

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

257666, 257671, 257669, 257674, H01L 2328, H01L 2350, H01L 2348

Patent

active

058216103

ABSTRACT:
Resin tie bars are formed between leads of external leads extending out from a resin-sealed region. The external leads are formed such that lead width at portions beyond the portion where the resin tie bars are formed is less than the lead width at portions where the resin tie bars are formed. With this construction, resin extending between the leads from the periphery of the resin-sealed region, including the resin tie bars, can be easily removed after resin-sealing when the resin tie bars are subjected to water sprayed at high pressure.

REFERENCES:
patent: 5126824 (1992-06-01), Ueda
patent: 5176366 (1993-01-01), Masumoto et al.
patent: 5285104 (1994-02-01), Kondo et al.
patent: 5486722 (1996-01-01), Sata et al.
patent: 5587606 (1996-12-01), Sekiba
patent: 5610437 (1997-03-01), Frechette
patent: 5637914 (1997-06-01), Tanaka et al.

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