Lead-on-chip semiconductor device

Details Lead-on-chip semiconductor device Lead-on-chip semiconductor device

1995-09-29

1997-07-15

Whitehead, Jr., Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257690, 257691, 257692, 257696, H01L 23495

Patent

active

056486804

ABSTRACT:
A semiconductor includes a Lead-on-chip (LOC) structure. A bonding pad solely for receiving a signal is formed parallel to a perimeter on top in the middle of the element-formation surface. A bonding pad solely for transmitting a signal is formed around the periphery of the element-formation surface, and an inner lead solely for receiving a signal has its tip positioned parallel to the perimeter on top in the middle of the element-formation surface. An inner lead solely for transmitting a signal has its tip positioned on top of the periphery of the element-formation surface.

REFERENCES:
patent: 4951122 (1990-08-01), Tsubosaki et al.
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5151559 (1992-09-01), Conru et al.
European Search Report dated Jan. 7, 1993.

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