Lead-on-chip semiconductor device and method for its fabrication

Details Lead-on-chip semiconductor device and method for its fabrication Lead-on-chip semiconductor device and method for its fabrication

1995-01-03

1996-11-05

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257696, H01L 23495

Patent

active

055720668

ABSTRACT:
A lead-on-chip (LOC) device (44) has a comb-shaped (32) or a cut-out (38) tape as the means of attachment for the leads (14) to the die surface. The LOC tape has cut-outs between the leads to minimize the amount of tape between the leads. The cut-outs are provided by either making the tape comb-shaped so that it has teeth and gaps between each tooth or by having oblong-shaped cut-outs in the tape corresponding in location the gaps between the leads. By minimizing the tape to die interface between the leads, the chance of voids forming between the leads is eliminated.

REFERENCES:
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5072280 (1991-12-01), Matsukura
patent: 5206536 (1993-04-01), Lim
patent: 5357139 (1994-10-01), Yaguchi et al.
patent: 5406028 (1995-04-01), Beng et al.

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