Lead-over-chip lead frames

Details Lead-over-chip lead frames Lead-over-chip lead frames

2005-09-27

2005-09-27

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S773000, C257S784000

Reexamination Certificate

active

06949813

ABSTRACT:
Lead-over-chip leadframes for coupling the chip bond pads to the interconnect pins of a memory package contain at least one composite lead for coupling an interconnect pin to chip bond pads in multiple quadrants or on opposite sides of the memory chip. The lead-over-chip leadframes are adapted for use in memory assemblies including memory chips having chip bond pads on both sides of the memory chip shorted to each other by a single lead of the lead-over-chip leadframe.

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