LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Frame for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Frame for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Frame for semiconductor package including plural lead frames...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Frames locking method for packaging semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Fully-molded leadframe stand-off feature

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Fuse frames, programmable fuse frames, and methods for programmi

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Fusion quad flat semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Gravitationally assisted control of spread of viscous...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Grid array type lead frame having lead ends in different planes

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Ground plane for exposed package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Ground plane for plastic encapsulated integrated circuit die pac

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Ground plane for plastic encapsulated integrated circuit die pac

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Ground-enhanced semiconductor package and lead frame for the...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Grounded embedded flip chip RF integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Heat dissipating wiring board and method for manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heat dissipation semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heat radiative electronic component

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Heat sink bonded to a die paddle having at least one aperture

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

Heat sink for semiconductor device assembly