Heat dissipating wiring board and method for manufacturing same

Details Heat dissipating wiring board and method for manufacturing same Heat dissipating wiring board and method for manufacturing same

2011-08-30

2011-08-30

Andujar, Leonardo (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

C257S668000, C257S702000, C257S706000

Reexamination Certificate

active

08008756

ABSTRACT:
A heat dissipating wiring board includes a metal wiring plate with a circuit pattern formed therein, a filler containing resin layer embedded with the metal wiring plate such that a top surface of the metal wiring plate is exposed, and a heat dissipating plate arranged on an under surface of the filler containing resin layer. The circuit pattern is formed of a through groove provided in the metal wiring plate. The through groove includes a fine groove that opens at the top surface of the metal wiring plate and an expanded groove that expands from a lower end of the fine groove toward the under surface of the metal wiring plate. The heat dissipating wiring board is capable of improving reliability against electric insulation due to dust or the like in a space of the through groove.

REFERENCES:
patent: 6060150 (2000-05-01), Nakatani et al.
patent: 6143981 (2000-11-01), Glenn
patent: 6483178 (2002-11-01), Chuang
patent: 6863962 (2005-03-01), Nakatani et al.
patent: 01115151 (1989-05-01), None
patent: 4-364770 (1992-12-01), None
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patent: 2001-210764 (2001-08-01), None
patent: 2003-152148 (2003-05-01), None
International Search Report issued Sep. 18, 2007 in the International (PCT) Application of which the present application is the U.S. National Stage.

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