Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent
1992-04-01
1992-12-29
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
361389, 257668, 257675, 257676, H01L 3902, H01L 2302, H01L 2348, H02B 100
Patent
active
051756129
ABSTRACT:
A first heat sink disposed immediately below and closely adjacent a semiconductor chip in a semiconductor chip assembly is disclosed. The heat sink is a flat metallic or ceramic shim. A second heat sink disposed immediately above and closely adjacent the semiconductor device is disclosed. The second heat sink preferably has a flat surface forming an exterior surface of the semiconductive device assembly . In one embodiment, the second heat sink has pedestals resting atop a plastic layer in a tape-like structure within the semiconductor chip assembly. In a second embodiment, the second heat sink includes an add-on portion that is external to the semiconductor chip assembly. The first heat sink is particularly well-suited to applications where the semiconductor chip assembly is mounted to a thermal mass. The second heat sink is particularly well-suited to applications where air cooling is available. Each of the first and second heat sinks provide effective cooling, and when used together provide even more effective cooling.
REFERENCES:
patent: 4141030 (1979-02-01), Eisele et al.
patent: 4340902 (1982-07-01), Honda et al.
patent: 4396935 (1983-08-01), Schuck
patent: 4587550 (1986-05-01), Matsuda
patent: 4620215 (1986-10-01), Lee
patent: 4803546 (1989-02-01), Sugimoto et al.
patent: 4890194 (1989-12-01), Derryberry et al.
patent: 5012386 (1991-04-01), McShane et al.
patent: 5047837 (1991-09-01), Kitano et al.
Long Jon
Patil Sadanand
Schneider Mark
James Andrew J.
Jr. Carl Whitehead
Linden Gerald E.
LSI Logic Corporation
Rostoker Michael D.
LandOfFree
Heat sink for semiconductor device assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat sink for semiconductor device assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat sink for semiconductor device assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1891347