Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1996-07-25
2000-08-29
Monin, Jr., Donald L.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257668, 257747, H01L 23495
Patent
active
061113085
ABSTRACT:
A plastic encapsulated integrated circuit package is disclosed which comprises a multilayer ground plane assembly bonded to a lead frame with an integrated circuit die bonded to the composite assembly. The multilayer ground plane assembly is first formed by bonding together a metal sheet, such as a copper sheet, and a thermally conductive insulating layer, such as a thermally conductive polyimide material, to which is also bonded a layer of a b-stage adhesive material. The ground plane assembly may be bonded to the lead frame by placing the b-stage adhesive layer of the ground plane assembly against the lead frame and heating the ground plane assembly and lead frame to a temperature of from about 120.degree. C. to just under 200.degree. C. for a time period not exceeding about 10 seconds to bond the b-stage adhesive layer to the lead frame without oxidizing the lead frame. An integrated circuit die is then attached to the composite assembly with an adhesive and the die attached assembly is then cured in a non-oxidizing atmosphere in an oven at approximately 150.degree. C. for about 90 minutes to cure the adhesive and the b-stage adhesive layer. The die may then be electrically connected to the lead frame. The bonded together ground plane/lead frame/die composite assembly may then be placed in a mold and encapsulated in plastic.
REFERENCES:
patent: 3943623 (1976-03-01), Mizutani et al.
patent: 3999285 (1976-12-01), Lewis et al.
patent: 4147889 (1979-04-01), Andrews et al.
patent: 4396936 (1983-08-01), McIver et al.
patent: 4410927 (1983-10-01), Butt
patent: 4446477 (1984-05-01), Currie et al.
patent: 4480262 (1984-10-01), Butt
patent: 4594770 (1986-06-01), Butt
patent: 4680613 (1987-07-01), Daniels et al.
patent: 4783428 (1988-11-01), Kalfus
patent: 4811081 (1989-03-01), Lyden
patent: 4843695 (1989-07-01), Doe et al.
patent: 4870474 (1989-09-01), Karashima
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4990719 (1991-02-01), Wright
patent: 5068708 (1991-11-01), Newman
patent: 5073521 (1991-12-01), Braden
patent: 5093989 (1992-03-01), Beltz
patent: 5208188 (1993-05-01), Newman
patent: 5237205 (1993-08-01), Newman
patent: 5559369 (1996-09-01), Newman
"Electric Materials", vol. 22, No. 7, Jul. 1, 1983, pp. 27-28.
"Modified Polyimide for Low End Packaging", Research Disclosure, Jan., 1987, p. 32.
MM Multi-Layer Molded High Performance PQFP, published by Intel containing the three following disclosures: Seth et al., "Plastic Quad Float Pack", 1989 Japan International Electronic Manufacturing Technology Symposium, Apr. 27, 1989, pp. 1-1 to 1-7.
Mallik et al., "Multi-Layer Molded Plastic Package", 1989 Japan International Electronic Manufacturing Technology Symposium, Apr. 27, 1989, pp. 2-1 to 2-9.
Mallik, et al., "High Performance PQFP", 39th Electronic Components Conference, May 24, 1989, pp. 3-1 to 3-9.
Advanced Micro Devices , Inc.
Dietrich Michael
Monin, Jr. Donald L.
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