Fully-molded leadframe stand-off feature

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Details

C257S730000, C257S679000

Reexamination Certificate

active

06897550

ABSTRACT:
A memory card comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. The traces are bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes. Disposed on and extending from the die pad and the traces is a plurality of stand-offs. At least one semiconductor die is attached to the die pad and electrically connected to at least one of the traces. A body at least partially encapsulates the leadframe and the semiconductor die such that the contacts are exposed in a bottom surface defined by the body.

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