Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate
2007-06-12
2007-06-12
Crane, Sara (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With separate tie bar element or plural tie bars
C257S666000, C257S676000, C257S691000, C257S698000
Reexamination Certificate
active
10635245
ABSTRACT:
A ground-enhanced semiconductor package and a lead frame used in the package are provided. The semiconductor package includes a lead frame having a die pad, a plurality of tie bars connected with and supporting the die pad, a plurality of leads surrounding the die pad, and a ground structure, wherein the ground structure comprises at least one of first ground portions connected to the tie bars, and/or at least one of second ground portions connected to the die pad, and wherein the first ground portions are separate from each other, and the second ground portions are separate from each other; at least one chip mounted on the die pad and electrically connected to the leads and the ground structure; and an encapsulation body for encapsulating the chip and the lead frame. The separately-arranged ground portions allow thermal stresses to be released from the ground structure without rendering deformation issues.
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Chen Holman
Huang Shih-Tsun
Lee Yi-Shiung
Li Chun-Yuan
Yun Chih-Yung
Corless Peter F.
Crane Sara
Edwards Angell Palmer & & Dodge LLP
Gebremariam Samuel A.
Jensen Steven M.
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