Frame for semiconductor package

Details Frame for semiconductor package Frame for semiconductor package

2005-05-24

2005-05-24

Wilson, Allan R. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S669000, C257S673000, C257S676000, C257S773000, C257S787000, C257S797000

Reexamination Certificate

active

06897549

ABSTRACT:
A frame for a semiconductor package has die-pads supported with suspending leads of individual lead frames. Semiconductor devices are arranged on the die-pads. These semiconductor devices are collectively molded with molding compound, and then the collectively molded semiconductor packages are cut into individual packages by means of a dicing saw. In the frame, suspending leads are formed into fish tails, wherein at least one of a longitudinal grid-lead and a transverse grid-lead is eliminated within areas enclosed with fish tails of the suspending leads. Accordingly, whether an R-shape generated by producing the frame by etching is large or small, the existence of metal pieces at the edges of the semiconductor packages is substantially prevented.

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