Heat sink bonded to a die paddle having at least one aperture

Details Heat sink bonded to a die paddle having at least one aperture Heat sink bonded to a die paddle having at least one aperture

1997-02-04

1998-07-21

Arroyo, T. M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257676, 257706, 257783, 257796, H01L 23495, H01L 2310, H01L 2334, H01L 2328

Patent

active

057838607

ABSTRACT:
A method of bonding an integrated circuit die to a heat sink by first providing a lead frame that has a die paddle portion having a top surface, a bottom surface, and at least one aperture therethrough, positioning a heat sink abutting the bottom surface of the die paddle portion, and then pressing an integrated circuit die against the top surface of the die paddle portion with an adhesive material sandwiched therein between such that the adhesive flows through at least one aperture in the die paddle portion to bond the integrated circuit die and the heat sink together.

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patent: 5444602 (1995-08-01), Banerjee et al.
patent: 5641987 (1997-06-01), Lee

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