Grounded embedded flip chip RF integrated circuit

Details Grounded embedded flip chip RF integrated circuit Grounded embedded flip chip RF integrated circuit

2005-06-21

2005-06-21

Tran, Thien F (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S678000, C257S706000, C257S707000, C257S717000, C257S719000, C257S720000

Reexamination Certificate

active

06909169

ABSTRACT:
A system for packaging an integrated circuit amplifier bonds the integrated circuit to metallization lines in a substrate surface with solder balls, the contacts of the integrated circuit being on a top surface and the opposite surface of the integrated circuit being adjacent to a set of vias for conducting heat away from the circuit into the ambient; the material for the material disposed about the integrated circuit being deposited in powder form and later solidified.

REFERENCES:
patent: 5909057 (1999-06-01), McCormick et al.

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