Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent
1996-06-18
1998-10-13
Ostrowski, David
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
257706, 257717, 257796, 361705, 361718, 361723, H01L 2334
Patent
active
058216120
ABSTRACT:
An electronic component provided with a heat radiative ceramic plate that is protected from cracks. Such a heat radiative electronic component is composed of an electronic device, such as a semiconductor device with an integrated circuit built therein, having a heat radiative plate bonded on its upper surface. The heat radiative plate is formed by a ceramic plate coated with a resin layer. The ceramic plate is a 1 mm to 2 mm thick quadrangular plate prepared by sintering cordierite powder, which has a high emissivity of far-infrared rays. The resin layer entirely or partly covers the surface of the ceramic plate, thereby preventing the plate from breaking and/or chipping and scattering ceramic powder to the surrounding area.
REFERENCES:
patent: 4352120 (1982-09-01), Kurihara et al.
patent: 4901137 (1990-02-01), Sato et al.
patent: 5379186 (1995-01-01), Gold et al.
patent: 5422788 (1995-06-01), Heinen et al.
patent: 5430331 (1995-07-01), Hamsehdoost et al.
patent: 5581121 (1996-12-01), Burn et al.
Muramatsu, Shigeji, "Manufacture of Semiconductor Device", Mar. 1, 1988, Abstract, No. JP 63-048850 (A).
Yokono, Ataru, "Parts for Heat Dissipation Use", Apr. 25, 1990, Abstract, No. JP 02-113561 (A).
Kitigawa Industries Co., Ltd.
Ostrowski David
LandOfFree
Heat radiative electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heat radiative electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat radiative electronic component will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-315573