Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent
1997-01-08
1998-10-13
Ostrowski, David
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
257724, 257787, 361813, 438112, H01L 23495
Patent
active
058216073
ABSTRACT:
A reusable metal frame for manufacturing of encapsulated semiconductor devices includes a metal sheet having a plurality of openings disposed in compliance with topology of semiconductor devices carried by a supporting structure. During the molding operation, the frame is superposed over the supporting structure with each semiconductor device to be encapsulated, positioned centrally within one of the openings. The encapsulating material (resin, plastic, or the like) is supplied to each semiconductor device and stays within each opening, held in place by continuous uninterrupted contour of each opening. After the encapsulating material has been cooled, the metal frame is readily removed, and may be used in other molding operations.
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Orient Semiconductor Electronics Ltd.
Ostrowski David
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