Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2011-07-12
2011-07-12
Gurley, Lynne A (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S669000, C257S676000, C257S670000, C257S672000, C257S784000, C257SE33060, C257SE23031, C257SE23042, C257SE23045, C438S123000, C438S124000
Reexamination Certificate
active
07977774
ABSTRACT:
A semiconductor package which includes a generally planar die paddle defining multiple peripheral edge segments and a plurality of leads which are segregated into at least two concentric rows. Connected to the top surface of the die paddle is at least one semiconductor die which is electrically connected to at least some of the leads of each row. At least portions of the die paddle, the leads, and the semiconductor die are encapsulated by a package body, the bottom surfaces of the die paddle and the leads of at least one row thereof being exposed in a common exterior surface of the package body.
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Choi YeonHo
Kim Gi-Jeong
Kim WanJong
Amkor Technology Inc.
Gebreyesus Yosef
Gurley Lynne A
Stetina Brunda Garred & Brucker
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