Substrate based unmolded package including lead frame...
Substrate for accepting wire bonded or flip-chip components
Substrate for holding a chip of semi-conductor package, semi-con
Substrate for holding a chip of semi-conductor package,...
Substrate for mounting semiconductor chip with parallel...
Substrate for use in semiconductor manufacturing and method...
Substrate having a plurality of I/O routing arrangements for...
Substrate structure capable of reducing package singular stress
Substrate with dam bar structure for smooth flow of...
Substrate with slot
Substrate-based IC package
Substrates for semiconductor devices with shielding for NC...
Support for semiconductor bond wires
Support matrix for integrated semiconductors, and method for...
Support matrix with bonding channel for integrated...
Support member for mounting a semiconductor device,...
Supporting frame for surface-mount diode package
Surface acoustical wave flip chip
Surface mount device with compensation for thermal expansion eff
Surface mount electronic component and process for...