Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-05-12
2008-11-25
Mandala, Victor A (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S692000, C257S693000, C257S782000, C257SE23031, C257SE23037, C438S108000, C438S123000
Reexamination Certificate
active
07456494
ABSTRACT:
A surface mount electronic component includes a set of a first lead terminal2aand a second lead terminal3b, a semiconductor element6adie-bonded to an island portion4aintegrally formed at an end of the first lead terminal, a metal wire7aelectrically connecting the semiconductor element and a bonding portion5bintegrally formed at an end of the second lead terminal to each other, and a package8made of synthetic resin and hermetically sealing the island portion and the bonding portion. The island portion and the bonding portion are formed by plastic deformation of a portion of each of the lead terminals to be positioned within the package from a lower surface side to reduce the thickness and increase the width. A portion of a lower surface of each of the first lead terminal and the second lead terminal which is not subjected to the plastic deformation is exposed at a lower surface of the package to serve as a mount surface for soldering, so that a soldering area large enough to perform soldering is provided at each of the lead terminals.
REFERENCES:
patent: 5977613 (1999-11-01), Takata et al.
patent: 6538306 (2003-03-01), Inada et al.
patent: 6821820 (2004-11-01), Inatsugu
patent: 7134311 (2006-11-01), Iwabuchi
patent: 2003/0038162 (2003-02-01), Chew et al.
patent: 1-106456 (1989-04-01), None
patent: 3-248551 (1991-11-01), None
patent: 9-298256 (1997-11-01), None
patent: 2003-258183 (2003-09-01), None
International Search Report from the corresponding application PCT/JP2005/008714, mailed on Jun. 7, 2005.
Hamre Schumann Mueller & Larson P.C.
Mandala Victor A
Rohm & Co., Ltd.
LandOfFree
Surface mount electronic component and process for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Surface mount electronic component and process for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface mount electronic component and process for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4050657