Substrate-based IC package

Details Substrate-based IC package Substrate-based IC package

2006-04-18

2006-04-18

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S737000, C257S738000, C257S778000

Reexamination Certificate

active

07030473

ABSTRACT:
The invention relates to a substrate-based IC package that includes a substrate on which a chip is mounted with a die attach material. The substrate is provided with a solder resist and has, on the side opposite the chip, conductor tracks provided with soldering globules. The conductor tracks are electrically coupled to the chip via wire jumpers, which extend through a bond channel which is filled with a mold compound. The chip and the substrate are encapsulated with a mold cap on the chip side. The substrate is provided with spacers for supporting a printing template for applying the die attach material. A strip of a solder resist that surrounds at least the bond channel gaplessly with essentially the same width is provided as the spacer.

REFERENCES:
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6297543 (2001-10-01), Hong et al.
patent: 6531763 (2003-03-01), Bolken et al.
patent: 6667560 (2003-12-01), Goh
patent: 6724076 (2004-04-01), Kahlisch et al.
patent: 2002/0030288 (2002-03-01), Murata
patent: 199 54 888 (2001-05-01), None
patent: 0 810 655 (1997-12-01), None

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