Supporting frame for surface-mount diode package

Details Supporting frame for surface-mount diode package Supporting frame for surface-mount diode package

2006-12-11

2008-12-16

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23048, C257SE23037, C257SE23039, C257SE23044, C257SE33059, C257SE33066, C257SE33057, C257S680000, C257S774000, C257S773000, C257S116000, C257S730000, C257S098000, C257S099000, C257S100000, C257S796000

Reexamination Certificate

active

07466015

ABSTRACT:
A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chip. wherein said supporting forms a cantilever over said first metallic contact and the overhanging end of the cantilever is glued to said second metallic contact.

REFERENCES:
patent: 2002/0017612 (2002-02-01), Yu et al.
patent: 2007/0241357 (2007-10-01), Yan

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