Substrate based unmolded package including lead frame...

Details Substrate based unmolded package including lead frame... Substrate based unmolded package including lead frame...

2006-06-13

2006-06-13

Andújar, Leoanrdo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Reexamination Certificate

active

07061077

ABSTRACT:
A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a lead frame structure including a die attach region with a die attach surface and a lead having a lead surface, and (ii) a molding material. The die attach surface and the lead surface are exposed through the molding material. A semiconductor die is on the die attach region, and the semiconductor die is electrically coupled to the lead.

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