Substrate having a plurality of I/O routing arrangements for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Details

C257S778000, C257SE23007, C257S141000

Reexamination Certificate

active

11025440

ABSTRACT:
A substrate is provided for packaging a microelectronic device having a pattern of contacts on the surface thereof. The substrate is formed from a support member having a substantially planar surface, and first, second, and third electrically conductive paths. The electrically conductive paths each extends from a corresponding device-attachable region on the substantially planar surface. The third device-attachable regions are each substantially equidistant to the first and second device-attachable regions. In addition, the device contact pattern may correspond spatially to a pattern formed by the first and third device-attachable regions or by the second and third device-attachable regions may form a second pattern. Also provided is a method for attaching a microelectronic device to a substrate. The invention is particularly suited for use in forming packages having a flip-chip configuration.

REFERENCES:
patent: 5777379 (1998-07-01), Karavakis et al.
patent: 5861666 (1999-01-01), Bellaar
patent: 5929517 (1999-07-01), Distefano et al.
patent: 6043563 (2000-03-01), Eldridge et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6225688 (2001-05-01), Kim
patent: 6465893 (2002-10-01), Khandros
patent: 6699730 (2004-03-01), Kim
patent: 6847107 (2005-01-01), Fjelstad et al.

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