Substrate with slot

Details Substrate with slot Substrate with slot

2006-01-27

2008-11-11

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

C257S668000, C257S672000, C257S778000, C257SE23043, C257SE23046

Reexamination Certificate

active

07449770

ABSTRACT:
The invention relates to a substrate with slot. The substrate of the invention comprises an active surface and a plurality of metal plates. The metal plates are formed on the active surface. Each metal plate has a first surface and a second surface. The first surface is connected to the active surface. At least one metal plate has at least one slot formed on the second surface. Therefore, according to the substrate with slot of the invention, a resin for connecting a chip and the metal plates can entirely seal sides and corners of the chip so as to prevent water or dust from entering the chip and protect the chip.

REFERENCES:
patent: 4330790 (1982-05-01), Burns
patent: 4496965 (1985-01-01), Orcutt et al.
patent: 5812381 (1998-09-01), Shigeta et al.
patent: 6040623 (2000-03-01), Chan et al.
patent: 2002/0163068 (2002-11-01), Asada
patent: 2003/0127711 (2003-07-01), Kawai et al.

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