Support member for mounting a semiconductor device,...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Reexamination Certificate

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C257S672000, C257S676000, C257S100000

Reexamination Certificate

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07968980

ABSTRACT:
A semiconductor device comprises a support member having a pair of first conductive materials and a pair of second conductive materials on an insulating substrate, and a sealing member covering a semiconductor element arranged on the support member, wherein the support member has an insulating portion where the insulating substrate is exposed between the pair of the first conductive materials, and at least one of the pair of the second conductive materials is arranged along the side of the insulating portion, and the sealing member is disposed so that the sealing member is over at least a part of at least one of the first conductive materials and the second conductive materials.

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patent: 59149072 (1984-08-01), None
patent: 63081992 (1988-04-01), None
patent: 02114572 (1990-04-01), None
patent: 2004-200253 (2004-07-01), None
Partial European Search Report, directed to EP07102427, issued on Jun. 5, 2009, 4 pages.

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