Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent
1995-06-07
1997-03-11
Meier, Stephen
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
257666, 257692, 257696, 257773, 257785, 29827, 439513, 361769, H01L 23495, H01L 2348, H01L 2352, H01L 2940
Patent
active
056104367
ABSTRACT:
A surface mount electronic device, attachable to a circuit board, comprises an insulating substrate having a top surface and a bottom surface; a plurality of metallized terminal pads on the bottom surface; and a plurality of leads, each attached to one of the terminal pads by a solder column. Each of the leads comprises a first substantially horizontal lead portion attached to one of the terminal pads by the solder column. A plurality of upturned prongs on the first substantially horizontal lead portion forms a pronged area configured to hold the solder column. A second substantially horizontal lead portion terminates in a free end for attachment to the circuit board. An upwardly curved intermediate lead portion connects the first and second substantially horizontal portions and underlies the bottom surface of the substrate. The lead configuration provides compensation for stresses resulting from mismatching temperature coefficients of expansion between the substrate and the circuit board while providing a small "footprint" and a low vertical profile for the device.
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Rainey Robert R.
Sponaugle Roger
Arroyo T. M.
Bourns Inc.
Meier Stephen
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