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Single chip and stack-type chip semiconductor package and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Single die stitch bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Single layer leadframe design with groundplane capability

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Single layer leadframe design with groundplane capability

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Single layer surface mount package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Single Paddle having a semiconductor device and a passive...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Singulated semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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SMT three phase inverter package and lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Solder clad lead frame for assembly of semiconductor devices...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Solder pad configuration for use in a micro-array integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Solderable intergrated circuit lead frames plated with tin and p

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Solderable metal finish for integrated circuit package leads...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper
Reexamination Certificate

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Solid-state semiconductor light emitting device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Space-efficient package for laterally conducting device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Space-efficient package for laterally conducting device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Spring structure with stress-balancing layer

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Stabilizer/spacer for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Stack package and stack packaging method

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Stack semiconductor chip package and lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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