Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2006-08-08
2006-08-08
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S698000, C257SE23037
Reexamination Certificate
active
07087986
ABSTRACT:
A solder pad configuration for use in an IC package is described. Various embodiments of the invention describe IC packages, lead-frames, or substrate panels configured with generally noncircular solder pads at their bottom surfaces. The noncircular shapes allow for greater surface area than circular solder pads having diameters equal to a major dimension of the noncircular shapes, while maintaining the same metal-to-metal clearance between the pads and adjacent leads. This increased surface area provides for stronger and more reliable solder joints.
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Bayan Jaime A.
Lee Shaw Wei
Prabhu Ashok S.
Pert Evan
Sandvik Benjamin P.
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