Single chip and stack-type chip semiconductor package and...

Details Single chip and stack-type chip semiconductor package and... Single chip and stack-type chip semiconductor package and...

2007-02-13

2007-02-13

Lee, Calvin (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S782000, C438S612000

Reexamination Certificate

active

10945640

ABSTRACT:
A semiconductor package comprises a substrate having connection pads disposed thereon, a semiconductor chip attached to the substrate such that an active surface of the semiconductor chip faces the substrate, and external bonding pads electrically connected to the active surface of the semiconductor chip. The external bonding pads may be formed near the ends of the frame and have an upper surface facing away from the substrate. The external bonding pads are electrically connected with the connection pads.

REFERENCES:
patent: 6787915 (2004-09-01), Uchida et al.
patent: 2004/0089930 (2004-05-01), Beroz
patent: 10-070232 (1998-03-01), None
patent: 2000-61035 (2000-10-01), None
patent: 1020020079015 (2002-10-01), None
English language abstract of Korean Publication No. 1020020079015.
English language abstract of Japanese Publication No. 10-070232.
English language abstract of Korean Publication No. 2000-0061035.

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