Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate
2007-01-02
2007-01-02
Lee, Eugene (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With bumps on ends of lead fingers to connect to semiconductor
C257S672000, C257S459000, C257S676000, C257S735000, C257SE23024, C438S123000
Reexamination Certificate
active
10209502
ABSTRACT:
An integrated circuit device comprising an integrated circuit die mounted on a leadframe having a plurality of inner leads. The integrated circuit die has a plurality of bond pads that are electrically connected to the inner leads of the leadframe, wherein at least two bond pads are connected to a one of the plurality of inner leads and/or at least two inner leads are connected to one or more bond pads with a single bond wire. A single bond wire is connected to a first bond pad or inner lead and subsequently wedge or stitch bonded to a second bond pad or inner lead, then it is connected to a third bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and inner lead(s). The bond pad(s) of the die and inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.
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Otter, Chris: “Wirebonding in microelectronics”, http://www.twi.co.uk/j32k/protected/band—3/kscco001.html, 5 pages, Feb. 2001.
Chapter A: Wire Bonding, Level 2. Conclusions and guidline, Wirebonding techniques; 16 pages, no date.
Beauchamp Bruce
Fernandez Joseph D.
Phongsantichai Anucha
Tuthill Andrew
Baker & Botts L.L.P.
Lee Eugene
Microchip Technology Inc.
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