Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1994-10-07
1996-08-06
Prenty, Mark V.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257670, 257676, 257796, H01L 23495
Patent
active
055436579
ABSTRACT:
An electronic package including a leadframe that includes a single layer of an electrically conducting material, a semiconductor chip support, a common ground portion surrounding the semiconductor chip support and electrically connected thereto, a plurality of signal leads electrically isolated from each other and from the common ground portion, and a plurality of ground leads electrically connected to the common ground portion. A semiconductor chip including a plurality of signal sites and a plurality of ground sites is mounted on the semiconductor chip support of the leadframe. A plurality of electrical connections are provided between selected ones of the signal sites to respective ones of the signal leads and between selected ones of the ground sites to respective ones of the ground leads. A protective enclosure is provided substantially about the semiconductor device, the semiconductor chip support, the common ground portion of the leadframe, and at least a portion of the signal leads.
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IBM Technical Disclosure Bulletin vol. 29, No. 5, Oct. 1986, Multi-Chip Plastic Leaded Chip Carrier.
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Karnezos et al., EDQUAD-An Enhanced Performance Plastic Package, 1994 Proceedings 44th Electronic Components and Technology Conference, May 1, -May 4, 1994, IEEE 1994. pp. 63-66.
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Diagrams form a presentation by AMKOR Electronics Personnel in Fishkill May 18, 1994.
Diffenderfer Steven J.
Shaukatullah Hussain
International Business Machines - Corporation
Prenty Mark V.
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