Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2008-03-14
2010-02-23
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S666000, C257S784000, C257SE23037
Reexamination Certificate
active
07667309
ABSTRACT:
Efficient utilization of space in a laterally-conducting semiconductor device package is enhanced by creating at least one supplemental downbond pad portion of the diepad for receiving the downbond wire from the ground contact of the device. The supplemental diepad portion may occupy area at the end or side of the package formerly occupied by non-integral leads. By receiving the substrate downbond wire, the supplemental diepad portion allows a greater area of the main diepad to be occupied by a die having a larger area, thereby enhancing space efficiency of the package.
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Chia Anthony
Harnden James
Lam Allen K.
Weibing Chu
Williams Richard K.
GEM Services, Inc.
Parekh Nitin
Townsend and Townsend / and Crew LLP
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