Stack package

Details Stack package Stack package

1999-06-28

2000-06-13

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257787, H01L 23495

Patent

active

06075284&

ABSTRACT:
Disclosed is a stack package. In the stack package, at least two semiconductor chips 40 are disposed up and down. Inner leads 31 of lead frames 30 are attached at a bonding pad-disposed face of the semiconductor chip 40. The inner leads 31 are electrically connected to the bonding pads of the semiconductor chips 40 with metal wires 50. Protruding portions 33,34 are formed at the inner leads 31 toward downside and upside. To expose the respective protruding portions 33,34 and outer leads 32 formed at the lowermost lead frame 30, the respective semiconductor chips 40 are molded with an epoxy compound 60. The respective lead frames 30 are electrically connected by contacting the upwardly or downwardly protruding portions 34, 33 from the respective lead frames.

REFERENCES:
patent: 5302849 (1994-04-01), Cavasin
patent: 5327327 (1994-07-01), Frew et al.
patent: 5343366 (1994-08-01), Cipolla et al.
patent: 5514907 (1996-05-01), Moshayedi
patent: 5600541 (1997-02-01), Bone et al.
patent: 5612570 (1997-03-01), Eide et al.
patent: 5770888 (1998-06-01), Song et al.
patent: 5781413 (1998-07-01), Howell et al.
patent: 5818107 (1998-10-01), Pierson et al.
patent: 5821625 (1998-10-01), Yoshida et al.
patent: 5898212 (1999-04-01), Kim

Affiliated with

Also associated with

Rating

Stack package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stack package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stack package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2070687