Single layer leadframe design with groundplane capability

Details Single layer leadframe design with groundplane capability Single layer leadframe design with groundplane capability

1996-03-04

1998-09-29

Prenty, Mark V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257796, H01L 23495

Patent

active

058148779

ABSTRACT:
A method of making an electronic package. The method includes the step providing a leadframe of a single layer of material. The leadframe includes a semiconductor chip support, a plurality of signal leads, and a common ground portion substantially surrounding the chip support portion. A semiconductor chip having a plurality of signal sites and a plurality of ground sites is positioned on the semiconductor chip support of the leadframe. Selected ones of the signal sites of the semiconductor chip are selectively electrically connected to respective ones of the signal leads of the lead frame and selective ones of the ground sites of the semiconductor chip are selectively electrically connected to the common ground portion of the leadframe. Each of the signal leads of the leadframe are electrically isolated from each other and from the common ground portion of the leadframe.

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Diagrams from a presentation by AMKOR Electronics personnel in Fishkill May. 18, 1994.

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