SMT three phase inverter package and lead frame

Details SMT three phase inverter package and lead frame SMT three phase inverter package and lead frame

2007-11-20

2007-11-20

Le, Theo X (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S668000, C257S724000, C257S678000, C438S055000, C438S124000, C438S106000

Reexamination Certificate

active

11218019

ABSTRACT:
A surface mounted package for semiconductor die has a lead frame with a first and elongated die pad which receives three MOSgated die spaced along its length; second, third and fourth die pads laterally spaced from the first die pad and in a row parallel to the first die pad and receiving respective MOSgated die. A central wire bond receiving pad is disposed between the first pad and the spaced second, third and fourth pads. Wire bonds then connect the die into a three phase inverter circuit. Pin connectors extend through a plastic housing covering the top of the lead frame and are connectable, with the die pads, to the surface of a PCB.

REFERENCES:
patent: 5977630 (1999-11-01), Woodworth et al.
patent: 2001/0048154 (2001-12-01), Cheah et al.
patent: 2002/0149094 (2002-10-01), Sakabe
patent: 2003/0146498 (2003-08-01), Kondo et al.
patent: 2004/0095729 (2004-05-01), Vaysse et al.

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