Singulated semiconductor package

Details Singulated semiconductor package Singulated semiconductor package

2011-04-26

2011-04-26

Nguyen, Dao H (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

active

07932587

ABSTRACT:
A semiconductor device includes a singulated semiconductor package having a leadframe, a chip electrically coupled to the leadframe, encapsulating material covering the chip and a portion of the leadframe, and a material layer disposed over opposing ends of the leadframe. The leadframe includes a first face and an opposing second face, the first and second faces extending between opposing ends of the leadframe, where the second face configured to electrically couple with a circuit board. The chip is electrically coupled to the first face. The encapsulating material covers the chip and the first face of the leadframe. The material layer is configured to improve solderability of the singulated semiconductor package to the circuit board.

REFERENCES:
patent: 6608366 (2003-08-01), Fogelson et al.
patent: 6723585 (2004-04-01), Tu et al.
patent: 6773961 (2004-08-01), Lee et al.
patent: 6917097 (2005-07-01), Chow et al.
patent: 7125747 (2006-10-01), Lee et al.
patent: 7183630 (2007-02-01), Fogelson et al.
patent: 7205658 (2007-04-01), Lee et al.
patent: 2002/0017706 (2002-02-01), Sone
patent: 2002/0153596 (2002-10-01), Tsubosaki et al.
patent: 2003/0178707 (2003-09-01), Abbott
patent: 2004/0140541 (2004-07-01), Shimanuki
patent: 2004/0238923 (2004-12-01), Lee et al.
patent: 2005/0012187 (2005-01-01), Kameyama et al.
patent: 2005/0116321 (2005-06-01), Li et al.
patent: 2005/0121756 (2005-06-01), Chow et al.
patent: 2005/0127494 (2005-06-01), Liu
patent: 2005/0139972 (2005-06-01), Chiu et al.
patent: 2005/0173793 (2005-08-01), Rohrmoser et al.
patent: 2005/0194667 (2005-09-01), Huang et al.
patent: 2005/0199987 (2005-09-01), Danno et al.
patent: 2005/0255634 (2005-11-01), Yilmaz et al.
patent: 2005/0287709 (2005-12-01), Lee et al.
patent: 2006/0097366 (2006-05-01), Sirinorakul et al.
patent: 2006/0199308 (2006-09-01), Lee et al.
patent: 2007/0052070 (2007-03-01), Islam et al.
patent: 2007/0087649 (2007-04-01), Murakami et al.
patent: 2007/0176267 (2007-08-01), Abbott
patent: 2007/0262426 (2007-11-01), Mahler
patent: 2007/0273017 (2007-11-01), Maloney et al.

Affiliated with

Also associated with

Rating

Singulated semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Singulated semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Singulated semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2698574